Electronic device

ABSTRACT

An electronic device can include a housing that includes an optically transparent component. First and second light emitters can be positioned in the internal volume defined by the housing. A light detector can be positioned in the internal volume and can be optically isolated from the first and second light emitters within the internal volume. An opaque material can be disposed on the optically transparent component and can be positioned to inhibit light emitted from the second light emitter from reaching the light detector and to allow light emitted from the first light emitter to reach the light detector.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This claims priority to U.S. Provisional Patent Application No.63/037,961, filed 11 Jun. 2020, and entitled “ELECTRONIC DEVICE,” theentire disclosure of which is hereby incorporated by reference.

FIELD

The described embodiments relate generally to electronic devices. Moreparticularly, the present embodiments relate to wearable electronicdevices.

BACKGROUND

Electronic devices are increasingly being designed with deviceportability in mind, for example, to allow users to use these devices ina wide variety of situations and environments. In the context ofwearable devices, these devices can be designed to include manydifferent functionalities and to be operated in many different locationsand environments. The components of an electronic device, for example,the processors, memory, antennas, display, and other components canpartially determine a level of performance of the electronic device.Further, the arrangement of these components with respect to one anotherin the device can also determine the level of performance of theelectronic device.

Continued advances in electronic devices and their components haveenabled considerable increases in performance. Existing components andstructures for electronic devices can, however, limit the levels ofperformance of such devices. For example, while some components canachieve high levels of performance in some situations, the inclusion ofmultiple components in devices sized to enhance portability can limitthe performance of the components, and thus, the performance of thedevice. Consequently, further tailoring an arrangement of components forelectronic devices to provide additional or enhanced functionality,without introducing or increasing undesirable device properties, can bedesirable.

SUMMARY

According to some examples of the present disclosure, an electronicdevice can include a housing at least partially defining an internalvolume, the housing including an electromagnetically transparent portionat least partially defining an exterior surface of the electronicdevice. The electronic device can also include an antenna disposed inthe internal volume and positioned to emit a signal at a power levelthrough the electromagnetically transparent portion, and a sensingcircuit disposed in the internal volume and positioned to receive thesignal. The sensing circuit can be configured to measure a transmittedpower of the signal. A processor can also be disposed in the internalvolume, the processor being configured to compare the transmitted powerwith the power level.

According to some examples of the present disclosure, an electronicdevice can include a housing at least partially defining an internalvolume, the housing including an optically transparent component atleast partially defining an exterior surface of the electronic device, afirst light emitter positioned in the internal volume, a second lightemitter positioned in the internal volume, a light detector positionedin the internal volume, the light detector optically isolated from thefirst light emitter and the second light emitter within the internalvolume, and an opaque material disposed on the optically transparentcomponent, the opaque material positioned to inhibit light emitted fromthe second light emitter from reaching the light detector along a pathfrom the second emitter, through a medium adjacent to a portion ofexterior surface defined by the optically transparent component, andonto the light detector through the optically transparent component, andallow light emitted from the first light emitter to reach the lightdetector along a path from the first emitter, through the medium, andonto the light detector through the optically transparent component.

In some examples, the optically transparent component includes glass.The opaque material can be opaque to generally visible light, and/orspecifically to green light. The opaque material can be transparent toinfrared light. The opaque material can have a major dimension of 10 mmor less. The opaque material can have a thickness of 10 microns or less.The electronic device can further include a lens positioned over theopaque material. The optically transparent component can includesapphire. The optically transparent component can include a silicondioxide layer, and the opaque material can be disposed on the silicondioxide layer.

According to some examples, an electronic device can include a housingdefining an internal volume, the housing including an opticallytransparent portion, a light emitter disposed in the internal volume, afirst light detector disposed in the internal volume, a second lightdetector disposed in the internal volume, and a light blocking componentdisposed on an internal surface of the optically transparent portion,the light blocking component sized and positioned to prevent lightemitted by the light emitter from passing out of the electronic devicethrough the optically transparent component in a direction oriented moretowards the second light detector than the first light detector andallow light emitted by the light emitter to pass out of the electronicdevice through the optically transparent component in a directionoriented more towards the first light detector than the second lightdetector.

In some examples, the light blocking component has a substantiallycircular shape. The light blocking component can have a diameter of 10mm or less. The light blocking component can include a layer of ink. Thelayer can have a thickness of about 10 microns or less. The lightemitter can include an LED. The light blocking component includes afirst light blocking component and the electronic device furtherincludes a second light blocking component positioned in the internalvolume between the light emitter and the first light detector.

According to some examples, a housing for an electronic device caninclude a cover defining an aperture an optically transparent componentpositioned in the aperture and secured to the cover, the opticallytransparent component at least partially defining an internal surface ofthe housing and an external surface of the housing, a lens overlying aportion of the optically transparent component defining the internalsurface, and an opaque material disposed on the portion of the opticallytransparent component defining the internal surface, the opaque materialpositioned between the optically transparent component and the lens. Theopaque material can be opaque to visible light and at least partiallytransparent to infrared light. The lens can include a Fresnel lens. Theoptically transparent component can include glass.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1A shows a perspective view of an electronic device.

FIG. 1B shows a bottom exploded view of the electronic device of FIG.1A.

FIG. 2 shows an exploded view of an electronic device.

FIG. 3 shows an exploded view of a portion of an electronic device.

FIG. 4A shows a cross-sectional side view of a component of anelectronic device.

FIG. 4B shows an exploded cross-sectional view of the component of FIG.4A.

FIG. 4C shows a close-up cross-sectional view of a portion of thecomponent of FIG. 4A.

FIG. 4D shows an exploded cross-sectional view of a portion of thecomponent of FIG. 4A.

FIG. 5A shows an exploded view of a portion of an electronic device.

FIG. 5B shows a cross-sectional view of the electronic device of FIG.15A.

FIG. 5C shows a cross-sectional view of a component of an electronicdevice.

FIG. 5D shows a cross-sectional view of a component of an electronicdevice.

FIG. 5E shows a cross-sectional view of a component of an electronicdevice.

FIG. 6A shows a bottom perspective view of an electronic device.

FIG. 6B shows an exploded view of a portion of an electronic device.

FIG. 6C shows an exploded view of a component of an electronic device.

FIG. 6D shows an exploded view of a component of an electronic device.

FIG. 6E shows an exploded view of a component of an electronic device.

FIG. 7A shows a process flow diagram for a method of detecting apresence of a material near an electronic device.

FIG. 7B shows a process flow diagram for a method of detecting apresence of a material near an electronic device.

FIG. 8A shows a cross-sectional view of a component of an electronicdevice.

FIG. 8B shows a cross-sectional view of a component of an electronicdevice adjacent to a user.

FIG. 8C shows a cross-sectional view of a component of an electronicdevice adjacent to a user.

FIG. 8D shows a cross-sectional view of a component of an electronicdevice adjacent to a user.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

The architecture and components of the electronic devices describedherein can allow for configurations and designs that can maximize thenumber of functions and performance of a portable or wearable electronicdevice, while also allowing for the use of relatively low cost orabundant materials, and the reduction of manufacturing and assemblycomplexity and costs. While the use of high performance materials orhighly complex components can enable high levels of device performanceand functionality, these materials and components can also increase thecost of a device, thereby reducing the number of users who may be ableto reasonably afford the device. Accordingly, it can be desirable toprovide component designs that can incorporate relatively lower costmaterials and that have relatively lower manufacturing complexity, butthat still enable levels of performance and functionality that are onpar with, or sufficiently close to levels achieved by devices includinghigh performance materials and components.

These and other embodiments are discussed below with reference to FIGS.1A-7B. However, those skilled in the art will readily appreciate thatthe detailed description given herein with respect to these Figures isfor explanatory purposes only and should not be construed as limiting.

FIG. 1A shows an example of an electronic device 100. The electronicdevice shown in FIG. 1A is a watch, such as a smartwatch. The smartwatchof FIG. 1A is merely one representative example of a device that can beused in conjunction with the systems and methods disclosed herein.Electronic device 100 can correspond to any form of wearable electronicdevice, a portable media player, a media storage device, a portabledigital assistant (“PDA”), a tablet computer, a computer, a mobilecommunication device, a GPS unit, a remote control device, or otherelectronic device. The electronic device 100 can be referred to as anelectronic device, or a consumer device. In some examples, theelectronic device 100 can include a body 101 that can carry operationalcomponents, for example, in an internal volume at least partiallydefined by a housing of the body. The electronic device 100 can alsoinclude a strap 103, or another retaining component that can secured thedevice 100 to a body of a user, as desired. Further details of theelectronic device are provided below with reference to FIG. 1B.

Referring now to FIG. 1B, the electronic device 100 can include a body101 having a housing 102 and a cover 110 attached to the housing 102.The housing 102 can substantially define at least a portion of anexterior surface of the device 100. The cover 110 can include a ceramicmaterial such as sapphire, glass, plastic, or any other substantiallytransparent material, component, or assembly. The cover 110 can cover orotherwise overlay a display, a camera, a touch sensitive surface such asa touchscreen, or other component of the device 100. The cover 110 candefine a front exterior surface of the device 100. Together, the housing102 and the cover 110 can substantially define the exterior surface ofthe device 100.

In some examples, the housing 102 can include a component 130 thatdefines at least an exterior surface of the device 100. The component130 can be referred to as a back case or a back cover, and in someexamples, can be attached to one or more other components, such as thehousing 102. The component 130 can be attached to the housing 102 by anymethod known in the art or developed in the future, such as adhesivebonding, brazing, welding, overmolding, interference fitting, or othersecuring methods.

The back cover 130 can define one or more apertures or through holes. Atransparent material 132 can be disposed in the one or more apertures.In some examples, the transparent material 132 can be visuallytransparent and can include any transparent including a ceramic materialsuch as sapphire. The transparent material 132 can provide visual andelectromagnetic access to an exterior environment for one or morecomponents of the device 100, as described herein.

The housing 102 can include one or more features to receive or couple toother components of the device 100. For example, housing 102 can includefeatures, such as an indentation 104 to receive strap 103, and anaperture 108 to receive a button 148. The housing can also define one ormore apertures to receive additional input components, such as a dial ora crown 146.

The device 100 is merely one example of an electronic device 100.Additional electronic devices and designs thereof, are expresslycontemplated. Further details of example electronic devices andcomponents are provided below with reference to FIG. 2.

FIG. 2 illustrates an exploded view of a smartwatch 200 that can besubstantially similar to, and can include some or all of the features ofthe devices described herein, such as electronic device 100. The device200 can include a housing 202, a display assembly 210, and a back cover230. Together, the housing 202, the display assembly 210, and the backcover 230 can define an exterior surface and an internal volume of thedevice 200.

The housing 202 can be a substantially continuous or unitary component,and can define one or more openings 204, 206, 208 to receive componentsof the electronic device 200 and/or to provide access to an internalportion of the electronic device 200. In some examples, the device 200can include input components such as one or more buttons 248 and/or acrown 244 that can be disposed in the openings 206, 208. A microphonecan be disposed in the internal volume such that it is in communicationwith the external or ambient environment through the opening 204.

The display assembly 210 can be received by and can be attached to thehousing 202. The display assembly can include a cover 214 including atransparent material, such as plastic, glass, and/or ceramic. Thedisplay assembly 210 can also include a display stack 212 that caninclude multiple layers and components, each of which can perform one ormore desired functions. For example, the display stack 212 can include adisplay layer 212 that can include a touch detection layer or component,a force sensitive layer or component, and one or more display layers orcomponents that can include one or more pixels and/or light emittingportions to display visual content and/or information to a user. In someexamples, the display layer or component 212 can include a liquidcrystal display (LCD), a light emitting diode (LED) display, an organiclight emitting diode (OLED) display, and/or any other form of display.The display layer 212 can also include one or more electrical connectorsto provide signals and/or power to the display layer 212 from othercomponents of the device 200.

In some examples, the device 200 can include a gasket or a seal 216 thatcan be disposed between the display assembly 210 and the housing 202 tosubstantially define a barrier to the ingress of liquids or moistureinto the internal volume from the external environment at the locationof the seal 216. As described herein, the seal 216 can include polymer,metal, and/or ceramic materials. The device 200 can also include a seal234 that can be disposed between the housing 202 and the back cover 230to substantially define a barrier to the ingress of liquids or moistureinto the internal volume from the external environment at the locationof the seal 234. As described herein, the seal 234 can include polymer,metal, and/or ceramic materials. The seal 234 can be substantiallysimilar to and can include some or all of the features of the seal 216.

The device 200 can also include internal components, such as a hapticengine 224, a battery 222, and a logic board 240, also referred to as amain logic board 240, that can include a system in package (SiP) 242disposed thereon, including one or more integrated circuits, such asprocessors, sensors, and memory. The SiP can also include a package.

In some examples, internal components can be disposed below the mainlogic board 240 and can be disposed at least partially in a portion ofthe internal volume defined by the back cover 230. For example, thedevice 200 can include an electromagnetic shielding component, otherwisereferred to as an e-shield 252, that can shield other components in thedevice 200 from electromagnetic radiation from the ambient environmentand/or as emitted by other components in the device 200. The device 200can also include a second logic board 250 that can be in communicationwith one or more sensors or emitters of the device 200, for example, toreceive information or signals from an external environment. In someexamples, the second logic board 250 can also include a SiP. In someexamples, the device 200 can include one or more wireless antennas, suchas antenna 254, that can be in electrical communication with one or moreother components of the device 200. In some examples, the antenna 254can receive and/or transmit wireless signals at one or more frequenciesand can be, for example, one or more of a cellular antenna such as anLTE antenna, a Wi-Fi antenna, a Bluetooth antenna, a GPS antenna, amultifrequency antenna, and the like. The antenna 254 can becommunicatively coupled to one or more additional components of theelectronic device 200

The internal components can be disposed within the internal volumedefined at least partially by the housing 202, and can be affixed to thehousing 202 via internal surfaces, attachment features, threadedconnectors, studs, posts, or other features, that are formed into,defined by, or otherwise part of the housing 202 and/or the cover 214and/or back cover 330.

Any number or variety of components in any of the configurationsdescribed herein can be included in an electronic device, as describedherein. The components can include any combination of the featuresdescribed herein and can be arranged in any of the variousconfigurations described herein. The structure and arrangement ofcomponents of a device, as well as the concepts regarding the use andoperation of the components can apply not only to the specific examplesdiscussed herein, but to any number of embodiments in any combination.Various examples of electronic devices and electronic device componentsincluding having various features in various arrangements are describedbelow, with reference to FIGS. 3-4D.

FIG. 3 shows an exploded view of several components of an electronicdevice that can be substantially similar to and can include some or allof the features of the electronic devices described herein. As describedwith respect to the electronic device 200 of FIG. 2, an electronicdevice can include a housing 302 that can at least partially define aninternal volume and an input component, such as a crown or a dial 346that can be positioned at, and at least partially extend through, anaperture 306 defined by the housing 302. The crown module 346 can beconnected to one or more other components of the device (not shown).

FIG. 4A shows a cross-sectional view of an input component 400 of anelectronic device. The input component 400 can be a crown or a dial of acrown module, and can be substantially similar to the dials 246, 346described herein. In some examples, the crown 400 can be a component ofa crown module that can be substantially similar to and can include someor all of the features of the crown modules described in U.S. Pat. Nos.9,627,163 and 9,753,436, the entireties of which are incorporated byreference herein.

The input component 400 can include an outer portion or dial 402 that isconnected to a shaft 410, for example, with a lock ring 406. The dial402 can define an exterior surface of both the crown module and theelectronic device including the crown module. Further, the dial 402 canbe sized and shaped to be manipulated by a user, for example, to berotated by a user about an axis defined by the shaft 410. In someexamples, the dial 402 can include a cap or a ring 404 that can includea different material than the dial 402, and that can provide a desiredaesthetic appearance to the exterior of the dial 402. For example, thecap 404 can be brightly colored so as to be readily identifiable by auser.

In some examples, the shaft 410 can be affixed to the lock ring 406 byany desired technique, such as one or more of an adhesive, brazing, orwelding. In some examples, the shaft 410 can also include a threadedportion that can be received by other components of the crown module(not shown) and that can transmit rotational forces exerted on the dial402 to the module. All or a portion of the shaft 410 can extend througha collar 420 that can define an aperture or an orifice through which theshaft 410 can pass. The collar 420 can house the shaft 410 and canretain the shaft 410 in a desired position. In some examples, the shaft410 can include a protruding portion, for example, that protrudessubstantially perpendicularly from a central axis of the shaft 410. Insome examples, the protruding portion and a central portion of the shaftcan define a channel. One or more gaskets or o-rings 432 can be disposedbetween the shaft 410 and the collar 420 to provide or define a sealtherebetween, for example, to prevent the ingress of liquid orcontaminants into the internal volume of the device and/or the crownmodule. An additional gasket or o-ring 434 can be disposed on anothersurface of the collar 420 to provide or define a seal between the collar420 and one or more other components of the crown module. In someexamples, a bushing 422 can be mounted on an outer surface of the collar420 between the collar 420 and the shaft 410, such as the protrudingportion that defines the channel.

FIG. 4B shows an exploded cross-sectional view of the dial 402 and theshaft 410. As described above, a lock ring 406 can join or affix thedial 402 to the shaft 410. In some examples, the lock ring 406 caninclude a metal or metallic material, such as sheet metal, includingstamped sheet metal. The shaft can also include a metallic material, andin some examples, the lock ring 406 can be welded or brazed to the shaft410, for example, to a planar surface thereof. In some examples, thelock ring 406 can have a substantially circular or ring shape, and canfurther include one or more protrusions that extend from the ring, suchas in a direction that is substantially perpendicular to a plane of thering. These protrusions can be sized and shaped to correspond to lockingfeatures that are defined by the dial 402 so that the protrusions can bereceive and/or retained by the locking features of the dial 402. In someexamples, the lock ring 406 and/or protrusions can be affixed to thedial 402 by any technique as desired such as an adhesive. In someexamples, however, the lock ring 406 and/or protrusions may only bemechanically received and retained by the dial 402, for example, toprevent movement of the dial 402 relative to the shaft 410.

In some examples, the dial 402 can define a recess, a cavity, a trench,or a channel that can receive and/or retain the cap 404, for example, anengagement portion 405 thereof. In some examples, the cap 404 can have atoroidal or ring shape, however in some other examples, the cap can havea substantially circular shape, as shown. In some examples, theengagement portion 405 can extend substantially perpendicularly from aplane of the circle or ring, as shown. The cap 404 can include anydesired material, such as a polymer, a metal, or a ceramic material. Insome examples, the cap 404 can include a polymer material and can haveany desired color, such as a bright or visually distinctive color. Thus,in some examples, the cap 404 can provide a desired cosmetic oraesthetic appearance to the dial 402 without the need for a multi-partor multi-section dial 402 architecture that can result in an undesirableincrease in dial size or an undesirable increase in the distance thedial protrudes from the housing and/or crown module. The cap 404 can beretained at a desired location on the dial 402 by any desired technique.In some examples, a layer of adhesive or glue 403 can be provided in thetrench defined by the dial 402 to retain the cap 404. In some otherexamples, a mechanical interlock between the engagement portion of thecap and a corresponding engagement feature defined by the dial 402 canadditionally or alternatively retain the cap 404 in a desired positionon the dial 402.

FIG. 4C illustrates a close-up view of the engagement portion 405 of thecap 404 mating with an engagement feature 407 defined by the dial 402.As described above, the engagement feature 407 can take the form of atrench or channel. In some examples, and as shown in FIG. 4C, thechannel can have an undercut geometry or can include an undercut regionthat can receive and retain a corresponding feature of the engagementportion 405. Thus, in some examples, the engagement portion 405 caninterlock with an undercut feature in a channel defined by the dial 402.In some examples, such as where the cap 404 includes a polymer orplastic material, the cap 404 can flex and/or bend during insertion ofthe engagement portion 405 into the channel to allow some or all of theengagement portion 405 to snap into and/or interlock with the undercutregion of the channel 407. In some examples, the undercut region canhave a width of about 10 microns to about 100 microns, or about 25microns to about 75 microns, such as about 50 microns.

In some examples, an adhesive or glue material 403 can be disposed inthe channel 407 and can additionally or alternatively serve to affix thecap 404 to the dial 402. In some examples, in addition to affixing thecap 404 to the dial 402, the adhesive 403 can fill any empty volume inthe channel 407 and ensure that the cap 404 is disposed at a desireddepth in the channel 407, and thus relative the exterior surface of thedial 402. In some examples, the exterior surface of the cap 404 issubstantially flush, level, parallel with, and/or in-plane with theexterior surface of the dial 402.

FIG. 4D shows an exploded cross-sectional view of the collar 420 and thebushing 422, for example, as described with respect to FIG. 4A. In use,the bushing 422 can substantially surround a portion of the collar 420,such as the portion above the rim 421 that protrudes from the collar420. In some examples, the bushing 422 can be press-fit over the collar420 at the desired location. The collar 420 can define one or moreridges or retention features, as shown, that can retain the bushing 422in a desired position on the collar. In some examples, the bushing 422can be retained on the collar 420 at least partially due to aninterference fit between the components. In some examples, an innerdimension of the bushing 422 can have an interference fit with an outerdimension of the collar of between about 10 microns and about 100microns, about 25 microns and about 75 microns, or between about 30microns and about 60 microns. In some examples, this architecture canallow for a significantly reduced height of the bushing 422 and collar420 components, resulting in a reduce protrusion distance of the dial402.

In some examples, the collar 420 can include a metal or metal alloy,such as steel or aluminum. In some examples, the bushing 422 can includea polymer and/or ceramic material, such as a plastic or resin. In someexamples, the bushing 422 can include an acetal resin, such as DELRINbrand resin. In some examples, an inner surface of the bushing 422 canhave a chamfer to allow for the press-fit process. In some examples, aheight of the bushing can be about 1 mm or less, about 0.75 mm or less,or even about 0.6 mm or less. In some examples, an outer surface of thebushing 422 can define a groove or a channel 423. The groove 423 can bepositioned at or near a lower edge of the bushing 422, as shown. In someexamples, the components of the crown module that abut the bushing 422,such as the shaft 410, can cause wear on the bushing material over time.If no groove 423 was present, this wear could result in the formation ofchannel that can then have a lip. This lip could produce an undesirablesensation during depression of the dial 402 into the device, as theshaft would pass back and forth over the lip. By preemptively removingmaterial from the bushing 422 at the location of the groove 423, thematerial that might define the lip is no longer present, eliminatingthis issue if bushing wear does occur. In some examples, the groove 423can have a height of between about 0.01 mm to about 0.1 mm, for example,about 0.05 mm.

Any number or variety of components in any of the configurationsdescribed herein can be included in an electronic device as describedherein. The components can include any combination of the featuresdescribed herein and can be arranged in any of the variousconfigurations described herein. The structure and arrangement ofcomponents of a device, as well as the concepts regarding can apply notonly to the specific examples discussed herein, but to any number ofembodiments in any combination. Various examples of electronic devicesand electronic device components including having various features invarious arrangements are described below, with reference to FIGS. 5A-5C.

FIG. 5A shows an exploded view of several components of an electronicdevice 500 that can be substantially similar to and can include some orall of the features of the electronic devices described herein. Asdescribed with respect to the electronic device 200 of FIG. 2, anelectronic device can include a housing 502 that can at least partiallydefine an internal volume and a display assembly 510 that can beretained by the housing. The display assembly 510 can be received by andcan be attached to the housing 502, for example, at a feature defined bythe housing 502, such as a ledge, lip, or flange 503. The displayassembly can include a cover 514 including a transparent material, suchas plastic, glass, and/or ceramic. The display assembly 510 can includea display stack 512 that can include multiple layers and components,each of which can perform one or more desired functions. In someexamples, a gasket or a seal 516 can be disposed between the displayassembly 510 and the housing 502, for example, at the ledge 503, tosubstantially define a barrier to the ingress of liquids or moistureinto the internal volume from the external environment at the locationof the seal 516.

FIG. 5B shows a cross-sectional view of the housing 502, with thetransparent cover 514 and seal 516 attached to the housing in anassembled configuration. As can be seen, the seal 516 can be in contactwith the transparent cover 514, and the housing 502 and can fix orsecure these two components together. In some examples, the seal 516 caninclude multiple layers of material. As described herein, the seal 516can include polymer, metal, and/or ceramic materials. In some examples,the seal 516 can substantially surround a periphery of an aperturedefined by the housing 502, and can have a shape corresponding to aperipheral shape of one or more portions of the display assembly 510.

FIG. 5C shows a cross-sectional view of the seal 516, for example, asshown in FIGS. 5A and 5B. In some examples, the seal 516 can includemultiple layers of material bonded or joined together in a stackedconfiguration. In some examples, the seal 516 can include a siliconelayer 520, such as a silicone rubber layer. The silicone layer 520 canbe the middle layer or core of the seal 516, and can have a thickness ofbetween about 50 microns and about 300 microns, or between about 100microns and about 200 microns, for example, about 150 microns. In someexamples, the silicone layer 520 can be substantially transparent. Thesilicone layer 520 can have a hardness of greater than about 5, greaterthan about 10, or greater than about 15 or more on the Shore A hardnessscale.

In some examples, polymer layers 523 and 525 can be disposed on the topand bottom surfaces of the silicone layer 520. These polymer layers 523,525 can be the same or different materials, and in some examples, caninclude polyimide. In some examples, the polymer layers 523, 525 can betransparent or translucent. In some examples, the polymer layers 523,525 can be a colored translucent material, such as a translucent ambercolored material. In some examples, the polymer layers 523, 525 can bethe same or different thicknesses. The polymer layers 523, 525 can havethicknesses between about 25 microns and about 150 microns, or betweenabout 50 microns and about 100 microns, for example, about 75 microns.

In order to secure the cover 514 to the housing 502 as shown in FIG. 5B,in some examples, the top and bottom exterior surfaces of the seal canbe defined by adhesive layers 522, 524. These adhesive layers can be thesame or different material, and can have the same or differentthicknesses. In some examples, the adhesive layers 522, 524 can includea pressure sensitive adhesive material. The adhesive layers 522, 524 canhave thicknesses between about 10 microns and about 100 microns, orbetween about 25 microns and about 75 microns, for example, about 50microns. The adhesive layers 522, 524 can have a hardness of greaterthan about 5, greater than about 10, greater than about 12, or greaterthan about 15 or more on the Shore A hardness scale.

Thus, in some examples, the entire seal 516 can have a thickness ofbetween about 200 microns and about 600 microns, or between about 300microns and about 600 microns, for example, about 400 microns. Further,the seal can have a width of between about 500 microns and about 1500microns, or between about 750 microns and about 550 microns, forexample, about 900 microns.

Referring again to FIG. 5B, the width of the seal 516 and/or the widthof the adhesive bond of the adhesive layers 522, 524 can be importantfor increasing the chemical resistance of the seal 516 and preventingcorrosion of the seal 516 and/or ingress of liquid or contaminants intothe internal volume therethrough. As shown, the housing 502 and thecover 514 can define a gap 505 therebetween. In some examples, this gapcan provide for a certain amount of sway or movement of the cover 514relative to the housing 502, such as during high force events or dropevents. This sway and/or compression of the seal 516 can reduce the riskof forces being transmitted through the housing 502 to the cover 514,thereby reducing the risk of damage to the cover 514.

In some examples, however, liquids, particles, contaminants, and/orcorrosive materials can inadvertently enter the gap 505, and can come incontact with the seal 516. Thus, it can be desirable for the seal 516 tobe corrosion resistant and for the bond length between the seal 516 andthe housing 502 and cover 514 to be relatively large.

FIGS. 5D and 5E illustrate cross-sectional views of alternative sealdesigns 616 and 716. In some examples, a seal 616 can include arelatively stiff core material 622 surrounded by a relatively soft orcompliant material 620. In some examples, the core 622 can include oneor more metals and/or polymers, such as stainless steel. The core 622can then be overmolded with a polymer material 620, such as a siliconematerial in any desired shape. In some examples, one or more layers ofadhesive 625 can be disposed on one or more surfaces of the siliconelayer 620 to adhere the seal 616 to components, such as a housing orcover.

The seal 616 can also include a core 622 that can include one or moremetals and/or polymers, such as stainless steel, and that can beovermolded with a polymer material 620, such as silicone. As shown, theseal 616 can have a substantially X-shaped cross-section, for example,defining one or more indentations or divots that can extend partially orentirely along one or more surfaces of the seal 616. In some examples,the shape of the seal 616 can allow for desired levels of compression ordeformation of the seal 616 to effectively dissipate energy and toprovide a desired level of sealing between components.

Any number or variety of components in any of the configurationsdescribed herein can be included in an electronic device, as describedherein. The components can include any combination of the featuresdescribed herein and can be arranged in any of the variousconfigurations described herein. The structure and arrangement ofcomponents of a device, as well as the concepts regarding the functionand use thereof can apply not only to the specific examples discussedherein, but to any number of embodiments in any combination. Variousexamples of electronic devices and electronic device sensor componentsincluding having various features in various arrangements are describedbelow, with reference to FIGS. 6A-7B.

FIG. 6A shows a bottom perspective view of an electronic device 800 thatcan be substantially similar to, and can include some or all of thefeatures of the electronic devices described herein. The device 800 caninclude a back cover 830 that can be attached to the housing 802, forexample, opposite the display assembly 810. The back cover 830 caninclude ceramic, plastic, metal, or combinations thereof. In someexamples, the back cover 830 can include an at least partiallyelectromagnetically transparent component 832. The electromagneticallytransparent component 832 can be transparent to any desired wavelengthsof electromagnetic radiation, such as visible light, infrared light,radio waves, or combinations thereof. In some examples, theelectromagnetically transparent component 832 can allow sensors and/oremitters disposed in the housing 802 to communicate with the externalenvironment. In some examples, the electromagnetically transparentcomponent 832 and/or back cover 830 can allow one or more antennasdisposed in the internal volume, such as antenna 840, to emit and/orreceive electromagnetic radiation, as described further herein.Together, the housing 802, display assembly 810, and back cover 830 cansubstantially define an internal volume and an external surface of thedevice 800.

FIG. 6B shows an exploded view of components of the electronic device800. The electronic device 800 can include additional components asdescribed herein, which have been omitted from FIG. 6B for simplicity.In some examples, the back cover 830 can carry a number of componentsthereon, such as a first antenna element 836, a logic board 850, asensing package and/or sensor module 852 and a light directing component854, a second antenna element 840, and a connection component 853 toelectrically connect the second antenna element 840 to one or morecomponents of the device 800, such as the logic board 850. In someexamples, one or more of these components, such as the sensor module 852and the second antenna 840, can be disposed over the electromagneticallytransparent portion 832 of the back cover 830. In some examples, a seal834 can be disposed between the back cover 830 and the housing 802 toprovide or define a barrier between the internal volume and the ambientenvironment, as described herein. Further details of the second antenna840, also referred to as a sensing antenna 840, are described withrespect to FIG. 6C.

FIG. 6C shows an exploded view of several components of an electronicdevice, such as the electronic device 800 described with respect toFIGS. 6A and 6B. In some examples, a device can include a back cover(omitted for simplicity) including an electromagnetically transparentportion 932, as described herein. The device can also include a logicboard 950 that can include a substrate, such as a printed circuit boardsubstrate, and can have one or more electronic and/or operationalcomponents thereon, such as one or more processors, memory, sensors,and/or integrated circuits. As described with respect to device 800, anelectronic device can also include a sensor module 952, a sensingantenna 940, and a light directing component 954 disposed in theinternal volume, for example, overlying the electromagneticallytransparent portion 932. In some examples, the sensor module 952 caninclude one or more light emitting and/or sensing components, asdescribed further herein. The light directing component 954 can directlight that is emitted and/or that will be received by the sensor module952.

In some examples, the sensing antenna 940 can be used to determine apresence of a material at or near the exterior surface of an electronicdevice including the sensing antenna, for example, at or near anexterior surface at least partially defined by the electromagneticallytransparent portion 932. In use, the sensing antenna 940 can be inelectrical communication with one or more other components of the deviceand can be driven to emit and/or reflect electromagnetic radiation atone or more desired frequencies. In some examples, the sensing antenna940 can radiate energy at about 2.4 GHz, although substantially anyfrequency can be used. The device can also include an integratedcircuit, for example, disposed on the logic board 950, another logicboard of the device, such as a main logic board, or at any desiredlocation.

In use, the sensing antenna 940 is driven at a desired frequency, and anassociated sensing integrated circuit in the device can measure theperformance, efficiency, and/or resonance of the sensing antenna 940. Insome examples, a sensing integrated circuit can measure a differencebetween a power used to drive the antenna and a transmitted power at thelocation of the sensing integrated circuit. In some examples, a sensingintegrated circuit can measure a level of reflected power from thedriven antenna, or a level of reflectance, based on a signal and/orpower used to drive the antenna. In some examples, the sensingintegrated circuit can be located near the back cover of the device, forexample, on the logic board 950. Consequently, the sensing integratedcircuit can measure antenna efficiency and/or performance in a directionextending out of the back cover and/or electromagnetically transparentcomponent 932. In some examples, the device can include any number ofdesired sensing integrated circuits, positioned at any number oflocations within the internal volume of the device.

As a material or object is brought near the device, for example, nearthe electromagnetically transparent component 932, the dielectricproperties, or permittivity of the material or object can affect theperformance, efficiency, and/or resonance of the sensing antenna 940because at least some of the material or object can be in thetransmission path between the sensing antenna 940 and the sensingintegrated circuit and/or because a change in the dielectric propertiesof the region now including the material or object can shift theresonance or resonant frequency of the antenna. The presence of amaterial or object having a permittivity different than air in thetransmission path can result in a tuning and/or detuning of the sensingantenna 940 performance, which is then measured by the sensingintegrated circuit, for example, by measuring a change in thetransmitted efficiency and/or level or reflectance from the antenna. Thedegree to which the performance, efficiency, tuning, and/or resonance ofthe sensing antenna 940 is changed can be measured and can be used to atleast partially determine a presence and/or proximity of an object ormaterial near the device. In some examples, the degree to which theperformance, efficiency, tuning, and/or resonance of the sensing antenna940 is changed can be used to at least partially determine a compositionof the material and/or object.

In some examples, this proximity detecting functionality can be used toassist the device in determining whether it is actively being worn by auser or whether the device has been removed from a user's wrist. Thatis, the sensing antenna 940 and the sensing integrated circuit candetect a presence and/or proximity of a body part at or near the device.In some examples, the sensing antenna 940 and the sensing integratedcircuit can distinguish the presence of a body part at or near thedevice from the presence of a different object or material, such as atable. In this way, a user can initially authenticate themselves whenthe device, such as a smartwatch, is put on, and the device may notrequire further authentication until the device determines that it hasbeen removed from the user's wrist.

In some examples, the sensing antenna 940 can include a conductivematerial that is substantially surrounded and/or encapsulated by aninsulating material. In some examples, the conductive material caninclude a metal or metal alloy, such as copper. In some examples, theinsulating material can include a polymer material. In some examples,the insulating material can include an adhesive material, such as apressure sensitive adhesive material. The pressure sensitive adhesivematerial can aid in fixing the sensing antenna 940 in a desiredlocation, and can further assist in securing other components in thedevice. In some examples, the sensing antenna 940 can have asubstantially annular or ring shape, as shown. In some examples, thesensing antenna 940 can be a monopole antenna, a dipole antenna, or anydesired antenna topology. Further, in some examples, a spring finger orconnection component can be in electrical communication with theconductive material of the sensing antenna 940 and one or more othercomponents of the device, such as a component that can provide power toand can drive the sensing antenna 940. In some examples, the sensingantenna 940 can include a first layer of pressure sensitive adhesive, alayer of copper, and a second layer of pressure sensitive adhesiveoverlying the copper and the first layer of pressure sensitive adhesive.

In some examples, the sensing antenna 940 can include any conductivematerial in any shape or configuration as desired. In some examples, thesensing antenna 940 can be a pre-formed component including conductivematerial that is disposed in the internal volume of the electronicdevice. In some examples, however, the sensing antenna 940 can bedeposited, plated, or otherwise formed onto another component of theelectronic device. For example, a conductive material can be depositedin a desired shape or configuration onto the electromagneticallytransparent portion 932 to form the sensing antenna 940. In someexamples, the sensing antenna 940 can be formed by a vapor depositionand/or plating process, such as a physical vapor deposition and/orelectroplating process. Further, in some examples, an existing antennaof the electronic device can be used or can function as the sensingantenna 940. That is, an electronic device can include one or moreantennas, such as a cellular antenna, NFC antenna, LTE antenna, a Wi-Fiantenna, a Bluetooth antenna, and/or a GPS antenna, and one or more ofthese antennas can additionally or alternatively be driven or used asthe sensing antenna. In some examples, any antenna positioned adjacentto, or near the back cover of the device, and/or the electromagneticallytransparent portion 930 can be used as the sensing antenna.

FIG. 6D shows an exploded view of several components of an electronicdevice, such as the electronic device 800 described with respect toFIGS. 6A and 6B. As with the example shown in FIG. 6C, an electronicdevice can include a logic board 1050, a sensor module 1052, and asensing antenna 1040, for example, overlying the electromagneticallytransparent portion 1032. The sensing antenna 1040 can be substantiallysimilar to, can include some or all of the features of, and can functionsimilarly to the sensing antennas described herein. In some examples,the sensing antenna 1040 can include a polymer or plastic material, suchas a thermoplastic material. In some examples, the sensing antenna 1040can also include a conductive material, for example, in a desired designor configuration, integrated into the polymer material. In someexamples, the sensing antenna 1040 can be formed by a laser directstructuring (LDS) process. That is, a polymer material including anon-conductive metallic inorganic compound can be exposed to a laser ina desired pattern to write the antenna trace onto or into the polymermaterial which had previously be molded into a desired shape. Thus, insome examples, the sensing antenna 1040 can be shaped to fit next toand/or around one or more other components of the device, such as thesensor module 1052, and/or the logic board 1050. The entire package,including the logic board 1050, sensor module 1052, and sensing antenna1040 can then be adhered in place, for example, to theelectromagnetically transparent portion 1032.

FIG. 6E shows an exploded view of several components of an electronicdevice, such as the electronic device 800 described with respect toFIGS. 6A and 6B. As with the examples shown in FIGS. 6C and 6D, anelectronic device can include a logic board 1150, a sensor module 1152,and a sensing antenna 1140, for example, overlying theelectromagnetically transparent portion 1132. In the present example,the sensing antenna 1140 has been integrated into an existing componentof the electronic device that can serve one or more additionalfunctions. For example, the sensing antenna 1140 can include a flexibleelectrical connector that can be in electrical communication with one ormore components of the device. In some examples, the sensing antenna1140 can include an electromagnetic shielding component, or e-shield. Insome examples, an additional trace can be added to the component to formthe antenna. For example, an additional trace can be added at or nearthe portion of the component that defines the central orifice oraperture. Additional details regarding processes for detecting apresence and/or type of material at or near an electronic device aredescribed with respect to FIGS. 7A and 7B.

FIG. 7A shows a process flow diagram for a method 1200 of detecting apresence of a material near an electronic device. In some examples, themethod 1200 can be carried out by an electronic device including asensing antenna and one or more sensing integrated circuits, asdescribed with respect to FIGS. 6A-6D.

At block 1210, an antenna of an electronic device, such as the sensingantennas 940, 1040, 1140 can be driven at one or more desiredfrequencies and using a desired power. The antenna can be driven by oneor more operational components of the device that are in communicationwith the antenna component.

At block 1220, an efficiency, a level of performance, a level of tuningor detuning of the antenna, and/or a resonance or resonant frequency ofthe antenna can be measured at one or more locations on or in theelectronic device, as described with respect to FIGS. 6A-6D. In someexamples, the efficiency of the antenna can be measured at a locationsuch that the transmission path of a signal emitted by the antenna canpass through or near a desired portion of the exterior surface of theelectronic device. In some examples, the portion of the exterior surfacecan be defined by a portion of the back cover and/or transparent coverof the device. In some examples, the efficiency of the antenna can bemeasured by detecting a transmitted power from the antenna and comparingthe transmitted power to the power used to drive the antenna. In someexamples, the resonance or resonant frequency of the antenna can bemeasured by detecting a reflected power from the antenna and comparingthe reflected power to the power used to drive the antenna. As usedherein, the term transmitted power can be broadly applied to refer toboth the power of a signal transmitted or radiated from the antenna, aswell as to the reflected power or signal.

At block 1230, a presence of a material at or near an exterior surfaceof the electronic device can be determined, at least partially, based onthe measured efficiency and/or resonance. As described with respect toFIGS. 6A-6D, the presence of a material having a permittivity other thanair can affect the transmitted power, efficiency and/or resonance of theantenna. Accordingly, the measured efficiency or resonance can be usedto determine a permittivity of the space adjacent to or near an exteriorsurface of the device, and thus, the presence of a material or object.In some examples, block 1230 can further include determining a type ofthe material or object that is present at or near the electronic device.For example, block 1230 can further include determining whether anobject is conductive or insulating, as well as a level of conductivity.In some examples, block 1230 can include determining whether an objectis a user, a metal, a ceramic, a plastic material, organic matter, aliquid, or other types of material.

FIG. 7B shows a process flow diagram for a method 1300 of detecting apresence of a material near an electronic device. In some examples, themethod 1300 can be carried out by an electronic device including asensing antenna and two or more sensing integrated circuits, asdescribed with respect to FIGS. 6A-6D.

At block 1310, an antenna of an electronic device, such as the sensingantennas 940, 1040, 1140 can be driven at one or more desiredfrequencies and using a desired power. The antenna can be driven by oneor more operational components of the device that are in communicationwith the antenna component.

At block 1320, an efficiency, level of performance, level of tuning ordetuning of the antenna, and/or a resonance or resonant frequency of theantenna can be measured at a first location on or in the electronicdevice, as described with respect to FIGS. 6A-6D. In some examples, theefficiency of the antenna can be measured at a location such that thetransmission path of a signal emitted by the antenna can pass through ornear a desired portion of the exterior surface of the electronic device.In some examples, the portion of the exterior surface can be defined bya portion of the back cover and/or transparent cover of the device. Insome examples, the efficiency of the antenna can be measured bydetecting a transmitted power from the antenna and comparing thetransmitted power to the power used to drive the antenna. In someexamples, the resonance or resonant frequency of the antenna can bemeasured by detecting a reflected power from the antenna and comparingthe reflected power to the power used to drive the antenna. As usedherein, the term transmitted power can be broadly applied to refer toboth the power of a signal transmitted or radiated from the antenna, aswell as to the reflected power or signal.

At block 1330, an efficiency, level of performance, level of tuning ordetuning of the antenna, and/or a resonance or resonant frequency of theantenna can be measured at a second, different location on or in theelectronic device, as described with respect to FIGS. 6A-6D. In someexamples, the efficiency of the antenna can be measured at a locationsuch that the transmission path of a signal emitted by the antenna canpass through or near a desired portion of the exterior surface of theelectronic device. In some examples, the portion of the exterior surfacecan be defined by the other of a portion of the back cover and/ortransparent cover of the device as compared to the first location. Insome examples, the efficiency of the antenna can be measured bydetecting a transmitted power from the antenna and comparing thetransmitted power to the power used to drive the antenna. In someexamples, the first location can require a transmission path from theantenna to pass through the back cover, while the second location canrequire a transmission path to pass through the front cover.

At block 1340, a presence of a material at or near an exterior surfaceof the electronic device can be determined at least partially based onthe measured efficiency at the first location and/or the measureefficiency at the second location. As described with respect to FIGS.6A-6D, the presence of a material having a permittivity other than aircan affect the transmitted power and/or efficiency of the antenna.Accordingly, the measured efficiency at one or both of the first andsecond locations can be used to determine a permittivity of the spaceadjacent to or near an exterior surface of the device, and thus, thepresence of a material or object. In some examples, block 1340 canfurther include determining a type of the material or object that ispresent at or near the electronic device. For example, block 1340 canfurther include determining whether an object is conductive orinsulating, as well as a level of conductivity. In some examples, block1340 can include determining whether an object is a user, a metal, aceramic, a plastic material, organic matter, a liquid, or other types ofmaterial.

In some examples, one or more algorithms stored in the memory of thedevice can determine whether to determine the presence of the objectbased on the measured efficiency at the first location, at the secondlocation, and/or by using a weighted combination of the first locationand the second location. In some examples where a weight combination ofthe measured efficiency at the first and second locations is used, analgorithm can determine weights to assign to the efficiencies measuredat the first and/or second location. In some examples, the weights canbe between 0% and 100%. In some examples, a determination of whether touse the efficiency measured at the first location, at the secondlocation, or a combination of efficiencies measured at the first andsecond locations, can be based on factors other than the measuredefficiencies. These factors are not limited and can include the date ortime, a geographical location, input or signals from one or more othersensors, a user input, and others. Additional sensing components andprocesses can similarly be included.

FIG. 8A shows a cross-sectional view of a portion of an electronicdevice as described herein. The portion includes an electromagneticallytransparent component 1432 that can be part of a back cover (omitted forsimplicity) of a device as described herein. The device can also includea logic board 1450 mounted on the electromagnetically transparentcomponent 1432. The device can include one or more sensors and/oremitters, either as part of a sensor module as described herein, as partof the logic board 1450, and/or as standalone components. In someexamples, the device can include a lens or light directing component1434 that can be mounted adjacent to the electromagnetically transparentcomponent 1432. In some examples, the lens 1434 can be a Fresnel lens1434. In some examples, a light blocking component 1470 can bepositioned between the lens 1434 and the component 1432 as describedfurther herein.

The device can include light emitting components 1466, 1468. In someexamples, the light emitting components 1466, 1468 can include lightemitting diodes (LEDs) that can emit light at one or more desiredwavelengths. The device can also include light detecting components1462, 1464 that can be designed and arranged to receive light that hasbeen emitted by LEDs 1466, 1468, that has passed out of the devicethrough the lens 1434 and electromagnetically transparent component1432, and back into the device through the lens 1434 andelectromagnetically transparent component 1432. In some examples, lightblocking components, such as component 1436 can substantially opticallyisolate the LEDs 1466, 1468 from the detectors 1462, 1464 except alongdesired light paths. In some examples, the device can include a lightdirecting component, or light control component 1463 disposed oppositeone or both light detectors 1462, 1464. In some examples, the lightcontrol component 1463 can serve to allow only light incident on thelight control component 1463 at a certain angle or range of angles topass through, thereby serving as a filter.

FIG. 8B shows the device including the components described with respectto FIG. 8A positioned adjacent to a medium 1500, such as the extremityof a user 1500. As used herein, the term medium can refer to anymaterial, substance, and/or object in any state or combinations ofstates of matter. For example, air, water, and/or a human body can allbe considered mediums as used herein.

The light paths from the LEDs 1466, 1468 to the detectors 1462, 1464 areshown. In some examples, light that is emitted from the LEDs 1466, 1468and that passed into a user's body, and is then reflected back to thedetectors 1462, 1464 can be used to determine one or more physiologicaland/or biological properties of the user. In some examples, however, thedetermination of the physiological and/or biological property can bebased receiving light that has passed through desired depths of tissue.For example, light emitted from LED 1468 and received by detector 1464can penetrate a certain depth, while light emitted from LED 1466 andreceived by detector 1464 can reach a different depth. Difficulties canarise, however, when these two light paths overlap within the user'stissue, potentially introducing noise and making it more difficult todistinguish whether light as been emitted from detector 1466 or 1468.Accordingly, it can be desirable to reduce an amount of overlap of lightpaths within the user's tissue.

In the example shown in FIG. 8B, the electromagnetically transparentcomponent 1432 can include a ceramic material, such as sapphire, thathas a relatively high index of refraction. As shown, light emitted bythe LED 1468 can travel along light path 1481, into the user's bodyalong path 1482, and back to the detector 1464 along light path 1483. Asseen, light emitted from the LED 1466 can travel along light path 1484,into the user's body along light path 1485, and out to the detector1464. The relatively high index of refraction of the ceramic or sapphirecomponent 1432 can mean that the overlap region 1486 of the light pathswithin the user's tissue is relatively small, for example less thanabout 5%, 4%, 3.5%, or even less than about 3% of the volume of tissueilluminated. This amount of overlap can be accounted for throughalgorithms or other noise reduction techniques and can produce resultshaving a desirable level of accuracy.

FIG. 8C shows a cross-sectional view of the same components asillustrated in FIG. 8C, however the component 1432 now includes amaterial having a relatively lower refractive index, such as glass. Ascan be seen, the lower index of refraction can result in a significantlyhigher area or volume of overlap 1486. For example, the volume ofoverlap can be greater than 15%, greater than 20%, or even greater than25% of the volume of tissue illuminated. Thus, while a component 1432that includes glass can provide benefits to the device, such as reducedmaterial cost, reduced manufacturing cost, increased durability, ease ofcomponent replacement, and other benefits, the use of glass can have anundesirable effect on the determination of one or more biological and/orphysiological properties of the user.

Accordingly, as shown in FIG. 8D, a light blocking component 1470 can bepositioned on an interior surface of the component 1432 to block some orsubstantially all of the light emitted from the LED 1466 that wouldotherwise reach the detector 1464 and/or overlap with light emitted fromthe LED 1468. In this way, the overlap volume can be less than about 5%,4%, 3.5%, or even less than about 3% of the volume of tissue illuminatedeven with a component 1432 that includes glass or some other relativelylow refractive index material. In some examples, the light blockingcomponent 1470 can be positioned directly on the component 1432, forexample between the component 1432 and the Fresnel lens 1434. In someexamples, the light blocking component 1470 can be positionedsubstantially in the center of the component 1432.

In some examples, the light blocking component 1470 can take the form ofa dot or circular portion of ink or other material that can be opaque toone or more desired wavelengths, or ranges of wavelengths of light. Insome examples, the light blocking component 1470 can be opaque tovisible light, that is light having wavelengths between about 380 nm andabout 740 nm. In some examples, the light blocking component 1470 can beopaque to wavelengths of light emitted by the LEDs 1466, 1468. In someexamples, the LEDs 1466, 1468 can emit green light and thus the lightblocking component 1470 can be opaque to a range of wavelengths of lightincluding green light. That is, in some examples, the light blockingcomponent 1470 can be opaque to light including light having wavelengthsbetween about 520 nm and about 560 nm. In some examples, the lightblocking component 1470 can, in some examples, be transparent to one ormore other wavelengths of light, so as not to affect the functionalityof other sensors, emitters, and/or detectors of the device, such asthose which might utilize infrared wavelengths, or light havingwavelengths between about 740 nm and about 1 mm. In some examples, theink or material of the light blocking component 1470 can have athickness of about 15 microns or less, about 10 microns or less, about 7microns or less, about 5 microns or less, or even about 2 microns orless. In some examples, the light blocking component 1470 can have adiameter or major dimension of about 10 mm or less, about 5 mm or less,about 4 mm or less, or even about 2 mm or less.

In some examples, the light blocking component 1470 can be deposited onthe component 1432 by any combination of printing and/or depositionprocesses, such as a pad printing and/or one or more physical vapordeposition processes. In some examples, the surface of the component1432 can be treated prior to forming the light blocking component 1470.For example, a layer of silicon dioxide can be deposited on the surfaceprior to forming the light blocking component 1470.

Any of the features or aspects of the devices and components discussedherein can be combined or included in any varied combination. Forexample, the design and shape of the components or devices is notlimited in any way and can be formed by any number of processes,including those discussed herein. As used herein, the terms exterior,outer, interior, and inner are used for reference purposes only. Anexterior or outer portion of a component can form a portion of anexterior surface of the component, but may not necessarily form theentire exterior of outer surface thereof. Similarly, the interior orinner portion of a component can form or define an interior or innerportion of the component, but can also form or define a portion of anexterior or outer surface of the component.

Various inventions have been described herein with reference to certainspecific embodiments and examples. However, they will be recognized bythose skilled in the art that many variations are possible withoutdeparting from the scope and spirit of the inventions disclosed herein,in that those inventions set forth in the claims below are intended tocover all variations and modifications of the inventions disclosedwithout departing from the spirit of the inventions. The terms“including:” and “having” come as used in the specification and claimsshall have the same meaning as the term “including.”

To the extent applicable to the present technology, gathering and use ofdata available from various sources can be used to improve the deliveryto users of invitational content or any other content that may be ofinterest to them. The present disclosure contemplates that in someinstances, this gathered data may include personal information data thatuniquely identifies or can be used to contact or locate a specificperson. Such personal information data can include demographic data,location-based data, telephone numbers, email addresses, TWITTER® ID's,home addresses, data or records relating to a user's health or level offitness (e.g., vital signs measurements, medication information,exercise information), date of birth, or any other identifying orpersonal information.

The present disclosure recognizes that the use of such personalinformation data, in the present technology, can be used to the benefitof users. For example, the personal information data can be used todeliver targeted content that is of greater interest to the user.Accordingly, use of such personal information data enables users tocalculated control of the delivered content. Further, other uses forpersonal information data that benefit the user are also contemplated bythe present disclosure. For instance, health and fitness data may beused to provide insights into a user's general wellness, or may be usedas positive feedback to individuals using technology to pursue wellnessgoals.

The present disclosure contemplates that the entities responsible forthe collection, analysis, disclosure, transfer, storage, or other use ofsuch personal information data will comply with well-established privacypolicies and/or privacy practices. In particular, such entities shouldimplement and consistently use privacy policies and practices that aregenerally recognized as meeting or exceeding industry or governmentalrequirements for maintaining personal information data private andsecure. Such policies should be easily accessible by users, and shouldbe updated as the collection and/or use of data changes. Personalinformation from users should be collected for legitimate and reasonableuses of the entity and not shared or sold outside of those legitimateuses. Further, such collection/sharing should occur after receiving theinformed consent of the users. Additionally, such entities shouldconsider taking any needed steps for safeguarding and securing access tosuch personal information data and ensuring that others with access tothe personal information data adhere to their privacy policies andprocedures. Further, such entities can subject themselves to evaluationby third parties to certify their adherence to widely accepted privacypolicies and practices. In addition, policies and practices should beadapted for the particular types of personal information data beingcollected and/or accessed and adapted to applicable laws and standards,including jurisdiction-specific considerations. For instance, in the US,collection of or access to certain health data may be governed byfederal and/or state laws, such as the Health Insurance Portability andAccountability Act (HIPAA); whereas health data in other countries maybe subject to other regulations and policies and should be handledaccordingly. Hence different privacy practices should be maintained fordifferent personal data types in each country.

Despite the foregoing, the present disclosure also contemplatesembodiments in which users selectively block the use of, or access to,personal information data. That is, the present disclosure contemplatesthat hardware and/or software elements can be provided to prevent orblock access to such personal information data. For example, in the caseof advertisement delivery services, the present technology can beconfigured to allow users to select to “opt in” or “opt out” ofparticipation in the collection of personal information data duringregistration for services or anytime thereafter. In another example,users can select not to provide mood-associated data for targetedcontent delivery services. In yet another example, users can select tolimit the length of time mood-associated data is maintained or entirelyprohibit the development of a baseline mood profile. In addition toproviding “opt in” and “opt out” options, the present disclosurecontemplates providing notifications relating to the access or use ofpersonal information. For instance, a user may be notified upondownloading an app that their personal information data will be accessedand then reminded again just before personal information data isaccessed by the app.

Moreover, it is the intent of the present disclosure that personalinformation data should be managed and handled in a way to minimizerisks of unintentional or unauthorized access or use. Risk can beminimized by limiting the collection of data and deleting data once itis no longer needed. In addition, and when applicable, including incertain health related applications, data de-identification can be usedto protect a user's privacy. De-identification may be facilitated, whenappropriate, by removing specific identifiers (e.g., date of birth,etc.), controlling the amount or specificity of data stored (e.g.,collecting location data a city level rather than at an address level),controlling how data is stored (e.g., aggregating data across users),and/or other methods.

Therefore, although the present disclosure broadly covers use ofpersonal information data to implement one or more various disclosedembodiments, the present disclosure also contemplates that the variousembodiments can also be implemented without the need for accessing suchpersonal information data. That is, the various embodiments of thepresent technology are not rendered inoperable due to the lack of all ora portion of such personal information data. For example, content can beselected and delivered to users by inferring preferences based onnon-personal information data or a bare minimum amount of personalinformation, such as the content being requested by the deviceassociated with a user, other non-personal information available to thecontent delivery services, or publicly available information.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not target to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. An electronic device, comprising: a housing at least partially defining an internal volume, the housing comprising an optically transparent component at least partially defining an exterior surface of the electronic device; a first light emitter positioned in the internal volume; a second light emitter positioned in the internal volume; a light detector positioned in the internal volume, the light detector optically isolated from the first light emitter and the second light emitter within the internal volume; and an opaque material disposed on the optically transparent component, the opaque material positioned to: inhibit light emitted from the second light emitter from reaching the light detector along a path from the second emitter, through a medium adjacent to a portion of exterior surface defined by the optically transparent component, and onto the light detector through the optically transparent component; and allow light emitted from the first light emitter to reach the light detector along a path from the first emitter, through the medium, and onto the light detector through the optically transparent component.
 2. The electronic device of claim 1, wherein the optically transparent component comprises glass.
 3. The electronic device of claim 1, wherein the opaque material is opaque to green light.
 4. The electronic device of claim 1, wherein the opaque material is transparent to infrared light.
 5. The electronic device of claim 1, wherein the opaque material has a major dimension of 10 mm or less.
 6. The electronic device of claim 1, wherein the opaque material has a thickness of 10 microns or less.
 7. The electronic device of claim 1, further comprising a lens positioned over the opaque material.
 8. The electronic device of claim 1, wherein the optically transparent component comprises sapphire.
 9. The electronic device of claim 8, wherein: the optically transparent component comprises a silicon dioxide layer; and the opaque material is disposed on the silicon dioxide layer.
 10. An electronic device, comprising: a housing defining an internal volume, the housing comprising an optically transparent portion; a light emitter disposed in the internal volume; a first light detector disposed in the internal volume; a second light detector disposed in the internal volume; and a light blocking component disposed on an internal surface of the optically transparent portion, the light blocking component sized and positioned to: prevent light emitted by the light emitter from passing out of the electronic device through the optically transparent component in a direction oriented more towards the second light detector than the first light detector; and allow light emitted by the light emitter to pass out of the electronic device through the optically transparent component in a direction oriented more towards the first light detector than the second light detector.
 11. The electronic device of claim 10, wherein the light blocking component has a substantially circular shape.
 12. The electronic device of claim 11, wherein the light blocking component has a diameter of 10 mm or less.
 13. The electronic device of claim 10, wherein the light blocking component comprises a layer of ink.
 14. The electronic device of claim 13, wherein the layer has a thickness of about 10 microns or less.
 15. The electronic device of claim 10, wherein the light emitter comprises an LED.
 16. The electronic device of claim 10, wherein: the light blocking component comprises a first light blocking component; and the electronic device further comprises a second light blocking component positioned in the internal volume between the light emitter and the first light detector.
 17. A housing for an electronic device, comprising: a cover defining an aperture; an optically transparent component positioned in the aperture and secured to the cover, the optically transparent component at least partially defining an internal surface of the housing and an external surface of the housing; a lens overlying a portion of the optically transparent component defining the internal surface; and an opaque material disposed on the portion of the optically transparent component defining the internal surface, the opaque material positioned between the optically transparent component and the lens.
 18. The housing of claim 17, wherein the opaque material is opaque to visible light and at least partially transparent to infrared light.
 19. The housing of claim 17, wherein the lens comprises a Fresnel lens.
 20. The housing of claim 17, wherein the optically transparent component comprises glass. 